SELECTED PATENTS

  1. A. J. AdamczykW. D. Liu, Y. C. Lee, "Etching Solution For Selectively Removing Silicon From a Silicon‑Germanium/Silicon Stack During Manufacture of a Semiconductor Device", 2019U.S. Patent No. 20190085240.

  2. A. J. Adamczyk, J. K. Ge, C. H. Kuo, W. D. Liu, Y. C. Lee, "Etching Solution for Simultaneously Removing Silicon and Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor Device", 2019U.S. Patent No. 20190103282.

  3. A. J. Adamczyk, W. D. Liu, Y. C. Lee, "Etching Solution For Selectively Removing Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor Device", 2019U.S. Patent No. 20190088492.

  4. R. N. Vrtis, A. J. Adamczyk, R. G. Ridgeway, J. L. A. Achtyl, W. R. Entley, D. Sinatore, K. E. Theodorou, “Use of Silyl Bridged Alkyl Compounds for Dense OSG Films”, 2018U.S. Patent No. 20180122632.